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High-capacity benchtop video measurement system

Optical Gaging Products has introduced the SmartScope^® E18, a compact, benchtop video measurement system. Featuring a 12" x 12" stage, IntelliCentric™-E fixed-lens optics, and VIRTUAL ZOOM™ technology, it offers fully automatic 3-axis performance without taking up floor space. Standard LED lighting, a rigid fixed-bridge design, optional touch probes, and advanced metrology software ensure accurate, repeatable inspection.
Learn more.

Tech Tip: Fan selection - Why airflow is not just CFM

For many engineers, fan selection starts and ends with a single number: CFM (cubic feet per minute). Higher CFM feels like a clear win. More air moved must mean better cooling. However, in practice, this assumption is one of the most common causes of thermal problems, excess noise, and late-stage redesigns. Find out why.
Read this Orion Fans technical article.

Useful! Snap-together LED enclosure lighting

Seifert StripLite SL 4000 Series LED enclosure lighting provides bright illumination to 700 lumens. On/off switch and motion sensor models are available. Easily daisy chain up to 16 light strips. Magnetic or clip mounting. See video/info on website or contact Bristol Instruments for more information.
Learn about snap-together lighting.

The hidden hardware helping AI's heat problem: PCHEs

Across AI infrastructure, thermal constraints now connect semiconductor design with power and cooling systems. More compact, lighter, and efficient than conventional shell-and-tube models, printed circuit heat exchangers save floor space, reduce energy costs, and improve overall efficiency in dense, hyperscale environments.
Read the full article.

Nearly 1,000 parts: Industrial enclosure range expanded

Altech Corp. has expanded its industrial enclosure lineup to 10 unique series with nearly 1,000 parts! Designed for control, junction, and terminal applications, these plastic and aluminum housings offer up to IP69 protection. They mount directly to walls or panels, resisting chemicals, corrosion, flames, impacts, and severe outdoor conditions without sacrificing aesthetics.
Find your perfect enclosure today.

Cool Tools: MetraSCAN BLACK2 -- Next-gen shop-floor 3D inspection

You'll gain some superhero powers when you brandish FARO CREAFORM's new MetraSCAN BLACK2, a next-gen portable metrology-grade optical 3D scanner engineered to deliver total inspection flexibility on the shop floor. This unit boasts a 3-in-1 architecture that combines C-Track scanning, stand-alone scanning, and probing in a single metrology-grade system.
Read the full article.

Compact, touchless position sensors: Wear-free operation in tight spaces

Novotechnik's TFD-4000 Series of touchless linear position sensors delivers wear-free measurement in tight spaces. Featuring ranges up to 50 mm, IP67 protection, 12-bit resolution, and analog outputs, these reliable sensors operate from -40 C to 125 C across diverse industrial, mobile, and medical applications such as short-stroke linear valve positioning, solenoid valves, off-highway brake actuation, and more.
Learn more.

World's first 10-m safety laser scanner: See farther, protect more

Datasensing, Datalogic's Sensor & Safety and Machine Vision business unit, has launched the SLS10 Safety Laser Scanner, the world's first 10-meter safety laser scanner. Delivering a 275-degree scanning angle, 240-m² of coverage, and an 84-msec response time, the SLS10 protects larger workspaces with fewer devices. It features best-in-class angular resolution for precise AGV navigation, SIL-2/PLd compliance, dust immunity, and the new ONEGUI platform for simplified configuration.
Learn more and see it in action.

Accelerate AI-driven machine vision systems

BitFlow has announced full production of its Claxon CXP-12 frame grabbers, designed for NVIDIA GPU-accelerated machine vision. Across five models, the CoaXPress 2.0 lineup delivers up to 50 Gbps -- five times 10 GigE Vision -- eliminating data bottlenecks. The full CXP-12 specification ensures deterministic, high-bandwidth streaming to unleash modern AI inference models.
Learn more.

Millimeter-wave imaging inspection in real time

With its new quality and inspection R&S IMAGER millimeter-wave scanner, Rohde & Schwarz aims to simplify the industrial inspection of packaged products. The system sees through common packaging materials at production speed without using X-rays, protecting both products and operators. The high-contrast 3D images are used as digital twins and can be automatically integrated into AI-powered fault-detection systems. Sees through plastics, cardboard, and composites. Applications include food and beverage, pharmaceuticals, logistics.
Learn more.

What are single-loop process controllers?

PLCs are powerful, but complex control isn't always necessary. For standalone processes requiring single-variable monitoring -- like temperature, pressure, or flow -- a single-loop controller is ideal. See how single-loop controllers can streamline your next project.
Read the AutomationDirect tech tip.

Great Resources: Flexible circuit design guide

Tech-Etch uses advanced techniques to manufacture flex and rigid-flex circuits to exacting customer specs. Special processes include selective plating a single circuit with two different finishes, contoured circuits with variable metal thickness, semi-additive and subtractive techniques, open window or cantilevered contact leads, plus SMT for component assembly. Tech-Etch specializes in flexible circuits for medical, telecommunications, aerospace, semiconductor, and other high-reliability electronic applications.
Learn about flex circuits and get the guide (no registration required).

EMI Investigations: New immunity development system

Saelig Company announces the Langer E1 Immunity Development System for EMI investigations. This compact, affordable kit simulates burst and ESD interference to pinpoint layout weak spots down to IC pins. By eliminating "black box" guesswork early in development, engineers can efficiently identify coupling mechanisms, test measures, and resolve immunity issues before compliance failure.
Learn more and see it in action.

Battery packs for unmanned aerial vehicles

Re:Build Manufacturing has launched U.S.-assembled, NDAA-compliant lithium-ion battery packs for commercial, public safety, and defense UAV applications. Available in Core, Power, and Performance series, the packs use non-FEOC cells and are produced at Re:Build's advanced facility in New Kensington, PA. Re:Build also offers custom pack and battery management system development.
Learn more.

Easy-to-use precision measurement system

Optical Gaging Products has announced the StarLite S1, a compact, semi-automatic 3-axis video measurement system. It combines fully automatic video measurements with manual stage motion and features an IntelliCentric-S optical system for high-resolution images. Powered by Measure-X software, this system delivers fast, repeatable, high-accuracy results, making it ideal for both shop-floor and quality-control applications.
Learn more.

How small can semiconductors get? KAIST develops atomic-level prediction tech

As the global semiconductor industry enters the so-called "2-nanometer process" era, the actual size of transistors -- the core components of semiconductor chips -- still remains above 10 nm. How much smaller, then, can transistors actually get? Researchers at the Korea Advanced Institute of Science and Technology (KAIST) have developed a technology to predict that limit through quantum mechanical atom-level calculations.

A research team led by Professor Yong-Hoon Kim of the School of Electrical Engineering has developed a computational design technology that utilizes computer simulations to analyze and predict the scaling limits of transistors, a key challenge in developing next-generation semiconductor devices.

Transistors are ultra-small switches that turn electrical currents on and off, serving as key components that determine the performance and power efficiency of semiconductor chips that power smartphones, artificial intelligence computers, and more. The semiconductor industry has continuously downsized transistors to achieve higher performance and lower power consumption.

However, when the transistor size becomes excessively small, quantum tunneling occurs -- a quantum mechanical phenomenon where electrons pass through energy barriers they normally cannot cross -- making current control difficult. For this reason, identifying how much smaller transistors can be made within the boundaries of quantum tunneling is a critical task in next-generation semiconductor development.

However, it is virtually impossible to experimentally confirm the scaling limits of transistors directly. With current technology, it is difficult to precisely control and quantitatively analyze the contact area where the metal electrode and the semiconductor channel (the pathway through which current flows inside a transistor) meet at the atomic level.

The research team resolved this issue by utilizing ab initio or first-principles calculations, a method that computes material properties based solely on fundamental physics laws without relying on experimental data. The research team had previously developed and reported a new theoretical-computational framework called multi-space constrained-search density functional theory (MS-DFT), which extends the scope of first-principles calculations from materials to devices by precisely analyzing the complex quantum phenomena occurring at the interface where metal electrodes and semiconductors meet and across which electrons flow.

In this study, the team built on this framework to perform computational transfer length method (TLM) experiments, the gold standard experimental technique for extracting contact resistance (the resistance to current flow occurring at the metal electrode-semiconductor interface). Based on the atomic-level TLM calculations results, they identified the quantum tunneling limit (the length at which electrons stop leaking and begin to allow transistor current control).

Analysis of Contact Resistance and Critical Tunneling Length in Two-Dimensional Semiconductors Using the First-Principles Transfer Length Method. See study. [Credit: Image courtesy of KAIST]

 

 

 

 

The research team applied this technology to a monolayer MoS₂ (molybdenum disulfide) device, a representative two-dimensional semiconductor material that can be made as thin as an atomic layer and is a candidate material for next-generation transistor channels. As a result, the researchers were able to quantitatively analyze how deeply electrons penetrate into the channel and how much this hinders current flow control depending on the type of metal electrode and the contact atomic geometry. In other words, they clarified that the limit to how small a transistor can be made varies depending on which metal and contact structure are selected. This implies that the performance and limits of a device can now be predicted in advance solely through computer simulations before the actual transistor fabrication.

According to the research results, the critical tunneling length -- the maximum length at which electrons penetrate into the channel and begin to affect transistor operation -- was found not to be a single fixed value. This length emerged as a design variable that changes depending on the work function of the metal (the minimum energy required to remove an electron from a metal) and the contact structure of the interface where the metal and semiconductor meet. This signifies that the extent to which a transistor can be downsized depends on the combination of materials and structural design.

In particular, among the candidate metal types and contact structures considered, the research team confirmed that the length where electrons stop leaking could be reduced to less than 4 nm. This result demonstrates the possibility of making transistors even smaller than the levels achieved today.

Furthermore, the research team proposed a design strategy for next-generation semiconductor chips that reduce power consumption by combining two-dimensional semiconductors with different properties.

The study, in which Dr. Tae Hyung Kim participated as the first author, was published online on May 28 in the prestigious computational journal npj Computational Materials.

Source: The Korea Advanced Institute of Science and Technology (KAIST)

Published June 2026

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